About Our Company
Launched in 2023 with the goal of developing cutting edge Photonic Technology, LuminoLabs has become a global leader in providing top-quality high performance Photonic Devices for Telecom/Data Center, AI Neuromorphic Photonics, Silicon Photonics and Aero Space. LuminoLabs specializes in packaging and manufacturing various passive and active Photonics device products.
Most popular current products include:
Various Temperature-Insensitive Silica-on-Silicon DWDM multiplexers for Telecom and Data Center Photonics, Integrated Optical devices for AI Photonics and Neuromorphic Computing Photonics, and Optical Interconnect Devices for Silicon Photonics and Quantum Computer Photonics, and various Photonic sensors for Aero space and Complex Vehicle mobility. Though specific IPs and know-how’s about efficient process-engineering-in-optical packaging, LuminoLabs delivers specifically customized Photonics Solutions of top-performance and high-reliability with the lowest cost possible.
With a year of quality Photonics devices production, propelled and strengthened by substantial experiences in R&D investment and innovation, we now hold the global leadership position of very few in exclusive Photonic Solution with LuminoLabs-invented and LuminoLabs-owned proprietary IPs. We have successfully launched and delivered our products to the Global Tier 1 customers with the multi-year supply contracts.
Products and Solutions
Silica-on-Silicon Photonics DWDM Multiplexers for Telecom and Data Center
Integrated Photonic Integrated Circuits (PIC) for AI Photonics and Neuromorphic Computing Processors
Optical Interconnect Connectivity Devices for Si Photonics and Quantum Computer and AI-on-Board Optical I/O Package
Integrated Photonic Sensors for Vehicle Structural Health Monitoring at Harsh Extreme Aero Space Environment
Photonics Inertial Navigation System Sensors for Land, Sea, Air and Space Vehicles
Business Innovation
Value Proposition
Provider of Innovative Photonic Packaging and Integration Technologies
Eye Toward Establishing a Unique and Solid Leadership in Advanced Photonic Hardware Industries
Core Competency
Process Innovation and Scalability Innovation Based on Own IP
Expertise in Photonics Packaging
Temperature-Insensitive Packaging
Standard Photonics I/O Packaging
Multi-Fiber Connectivity Packaging
High PER Packaging
Photonics Hermetic Seal Packaging
Multichip Integration, Hybrid Integration, Passive Alignment, etc Multi-Fiber Connectivity Packaging
Ultra Precision Dicing and Polishing